1517 & 1512 Mini SIP Reed Relays

APPLICATION: High-Density Test Matrix Modules

The small footprint of reed relays with a stable contact resistance is essential for test matrix modules that need to pack as many relays as possible onto a PCB.

When it comes to providing stable contact resistance, experience in manufacturing reed switches with sputtered ruthenium contacts gives Comus an advantage over the competition. The 1517 series also features a 75% smaller PCB footprint than the industry-standard SIP relays, while the 1512 series has a 60% smaller PCB footprint.

Supporting Files

1517 & 1512 Mini SIP Reed Relays Press Release