Ultra Mini SIP

ApplicationApplications: High Density Test Matrix Modules

The New 1517 series Ultra Mini SIP is ideal for high density and reliable switching matrices used in ATE and data acquisition systems. As test matrix modules try to pack as many relays as possible onto a PCB, the need for a reliable small footprint reed relay with stable contact resistance is critical. The new 1517 series with its external metal shield offers the design engineer the ability to increase the number of contacts with minimal magnetic interaction.

Comus’ experience in manufacturing sputtered ruthenium switches gives us an advantage over the competition and the 1517 Ultra Mini SIP maintains the higher 10 Watt, 170 VDC switching voltage and 1 Amp carry current ratings of much larger footprint SIP relays.

Supporting Files

Ultra Mini SIP Press Release